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          Products

          Latest Product

          AD211 Plus II

          Automatic Direct Eutectic Die Attach System

          Latest Product Lens Holder Attach System

          AD280 Plus

          Automatic High Precision Die Attach System

          Latest Product

          AD819 Series

          Automatic Die Attach System

          Latest Product

          AD8312 Plus Series

          Automatic Die Bonding System (12” wafer handling)

          Latest Product

          AD832U

          Automatic Eutectic Die Bonding System

          Latest Product

          AD838L-G2

          Automatic Die Attach System

          Latest Product Wafer Handling

          AD9212 Plus

          Automatic Flip Chip Bonding System (12” wafer handling)

          Latest Product

          AFC Plus

          Die Bonder and Flip Chip Bonder

          Latest Product Misc

          eClip Plus Series

          Automatic Clip Bonding System

          Latest Product

          FIREBIRD TCB Series

          Automatic Thermal Compression Bonding System

          Latest Product

          ISLinDA

          Automatic Die Bonding System (12” wafer handling)

          Latest Product

          NANO

          Die Bonder and Flip Chip Bonder

          Latest Product

          NOVA Plus

          Die Bonder and Flip Chip Bonder

          Latest Product

          NUCLEUS Series / NUCLEUS-XL Series

          Multi-Purpose Precision Pick & Place Tool

          Latest Product

          Photon

          Automatic High Precision Die Attach System

          AD100

          High Speed Epoxy Die Bonder (for Vertical LED Application)

          AD210 Plus

          Automatic Die Bonding System (6” wafer handling)

          AD830 Plus

          Automatic Epoxy Die Attach System (6” wafer handling)

          AD830P-Plus

          Automatic Die Bonder

          AD832i

          Automatic Die Bonding System (8” wafer handling)

          AD881 Series

          Automatic Epoxy Die Bonder

          SD8312

          Automatic Soft Solder Die Bonding System

          AD830 Plus-R

          Automatic Epoxy Die Attach System (6” wafer handling)

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