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          CIS

          ASMPT provides innovative and cost-effective solutions that help you successfully meet the industry’s demand for faster and powerful devices.

          AUTOPIA

          Automatic Active Alignment System (for Automotive Camera Application)

          COSMOS

          Automatic 3D Sensing Alignment System

          Eagle AERO

          For High-end IC Applications

          Lens Holder Attach System

          IS600GS

          Automatic Active Alignment Bonding System for Camera Module Assembly

          Lens Holder Attach System

          IS868LA3

          Automatic Lens Holder Attach System

          DI-water Cleaning System

          ISCM868S

          Automatic DI-Water Cleaning System

          ISLinDA

          Automatic Die Bonding System (12” wafer handling)

          Ball Bonder OPTO/LED Wire Bonding Equipment

          Harrier Xtreme

          Dual-Head Extreme High Speed Wire Bonder

          OPTO/LED Wire Bonding Equipment

          iHawk Xpress XL

          Wire Bonder

          Ball Bonder OPTO/LED Wire Bonding Equipment

          iHawk Xtreme

          Wire Bonder

          Strip Form Substrates AOI System

          VIM300 / IS-VIM300

          Automated Optical Inspection

          Other Applications

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